This high-quality 35g Leaded Solder Paste is formulated with a precise blend of Sn63/Pb37 alloy, flux, and advanced additives for strong, reliable solder joints.
Designed for mobile phone repair, computer servicing, high-precision circuit boards, and SMT/BGA soldering, it offers excellent wetting, smooth flow, and long-lasting adhesion. Ideal for professional and electronic repair use.
Main Features:
Premium Sn63/Pb37 composition ensures smooth soldering and strong connections
Low melting point (183°C) for efficient and safe operation
Excellent wetting and high adhesion for precision soldering
Ideal viscosity stability — usable up to 48 hours after preparation
RoHS compliant and suitable for fine electronic and PCB work
Consistent performance across SMT, BGA, and micro-soldering applications
Suitable for professional repair environments and electronic workshops
Specifications:
Material: Sn-Pb alloy (Sn63/Pb37)
Melting Point: 183°C
Net Weight: 35g tub
Certification: RoHS Compliant
Viscosity Duration: Up to 48 hours
Operating Temperature: 22–28°C
Recommended Humidity: RH 30–60%
Applications: Mobile phone, computer repair, high-precision circuit boards, SMT/BGA soldering
