Leaded Solder Paste

This high-quality 35g Leaded Solder Paste is formulated with a precise blend of Sn63/Pb37 alloy, flux, and advanced additives for strong, reliable solder joints.

Designed for mobile phone repair, computer servicing, high-precision circuit boards, and SMT/BGA soldering, it offers excellent wetting, smooth flow, and long-lasting adhesion. Ideal for professional and electronic repair use.

Main Features:

• Premium Sn63/Pb37 composition ensures smooth soldering and strong connections
• Low melting point (183°C) for efficient and safe operation
• Excellent wetting and high adhesion for precision soldering
• Ideal viscosity stability — usable up to 48 hours after preparation
• RoHS compliant and suitable for fine electronic and PCB work
• Consistent performance across SMT, BGA, and micro-soldering applications
• Suitable for professional repair environments and electronic workshops

Specifications:

• Material: Sn-Pb alloy (Sn63/Pb37)
• Melting Point: 183°C
• Net Weight: 35g tub
• Certification: RoHS Compliant
• Viscosity Duration: Up to 48 hours
• Operating Temperature: 22–28°C
• Recommended Humidity: RH 30–60%
• Applications: Mobile phone, computer repair, high-precision circuit boards, SMT/BGA soldering